5G Related Products
  • FOWLP PROTOTYPE PROCESSING SERVICE
  • Integrated work of chip mounting, molding and rewiring. We can also process fan-in bumps on smal...
  • ASSIST-NAVI CORP.
  • IC & SENSOR PACKAGING TECHNOLOGY EXPO
  • NOVABOND EX
  • Low etching adhesion enhancement process on dielectric ans solder resist for 5G
  • ATOTECH JAPAN K.K.
  • IC & SENSOR PACKAGING TECHNOLOGY EXPO
  • MEMS RELAY
  • MEMS Technology of RF relays. Frequency up to DC 18GHz with SP4T, SP6T and DPDT contacts relay wi...
  • BRIGHT TOWARD INDUSTRIAL CO., LTD.
  • ELECTRONIC COMPONENTS & MATERIALS EXPO
  • CHUKOH FLO TM COPPER-CLAD LAMINATED CH2868D
  • This is a copper-clad laminated board using luororesin impregnated glass cloth. The transmissio...
  • CHUKOH CHEMICAL INDUSTRIES, LTD.
  • PRINTED WIRING BOARDS EXPO
  • DAIN SILVER PROCESS
  • DAIN SILVER is Non-cyanide silver plating process. DAIN SILVER GPE PROCESS is acidic bath possib...
  • DAIWA FINE CHEMICALS CO., LTD.
  • IC & SENSOR PACKAGING TECHNOLOGY EXPO
  • RD-500VL
  • A Rework Station Designed for Large Multilayered Thick Boards Odd Shape and Circular Boards The...
  • DEN-ON INSTRUMENTS CO., LTD.
  • INTERNEPCON JAPAN
  • RD-500V
  • ALL-IN-ONE High Performance Rework Station Capable of Reworking 01005 components on Flex Circui...
  • DEN-ON INSTRUMENTS CO., LTD.
  • INTERNEPCON JAPAN
  • RD-500SV
  • ALL-IN-ONE High Performance Rework Station Capable of Reworking 01005 Components on Flex Circui...
  • DEN-ON INSTRUMENTS CO., LTD.
  • INTERNEPCON JAPAN
  • CERAMIC WIRING BOED WITH HIGH THERMAL CONDUCTIVITY
  • Excellent heat dessipation for high-speed large-capacity transmission.
  • EBINA DENKA KOGYO CO., LTD.
  • INTERNEPCON JAPAN
  • GLASS THROUGH-HOLE PROCESS AND PLATING
  • High quality precise processing and reliable technology enable to make of "Glass substrate" for 5...
  • EBINA DENKA KOGYO CO., LTD.
  • INTERNEPCON JAPAN
  • HIGH FREQUENCY SIGNAL TRANSMISSION COAXIAL CABLE
  • This coaxial cable offers reliable signal transmission with low attenuation value charactered by ...
  • FENG TAI ELECTRONIC INTERNATIONAL CO., LTD.
  • ELECTRONIC COMPONENTS & MATERIALS EXPO
  • HIGH-DENSITY AND HIGH-LAYER COUNT PCBS FOR HIGH-SPEED TRANSMISSION
  • Provide Ultra-high-speed PCBS for 5G networking systems and Millimeter-wave applications, combini...
  • FUJITSU INTERCONNECT TECHNOLOGIES LTD.
  • PRINTED WIRING BOARDS EXPO
  • PCB
  • PCB
  • HUIYANG TECHWISE INDUSTRIAL TECHNOLOGY CO., LTD.
  • PRINTED WIRING BOARDS EXPO
  • PCB
  • PCB
  • HUIYANG TECHWISE INDUSTRIAL TECHNOLOGY CO., LTD.
  • PRINTED WIRING BOARDS EXPO
  • PCB
  • PCB
  • HUIYANG TECHWISE INDUSTRIAL TECHNOLOGY CO., LTD.
  • PRINTED WIRING BOARDS EXPO
  • INDIUM8.9HF-1 SOLDER PASTE
  • Indium8.9HF-1 is specially formulated to deliver outstanding voiding performance for highly-relia...
  • INDIUM CORPORATION
  • IC & SENSOR PACKAGING TECHNOLOGY EXPO
  • LV1000
  • Indium Corporation provides LV1000 performs to answer the demands of 5G wireless infrastructure b...
  • INDIUM CORPORATION
  • IC & SENSOR PACKAGING TECHNOLOGY EXPO
  • RF COAXIAL TEST SOCKETS GRC SERIES
  • Over the past few years, A communication device has to be developped faster more and more, for Au...
  • JC ELECTRONICS CORPORATION
  • LED & LASER DIODE TECHNOLOGY EXPO
  • PWB
  • PWB, FPC, Trial production Quick delivery
  • K2 CO., LTD.
  • ELECTRONIC COMPONENTS & MATERIALS EXPO
  • MICROCLEANER ECO -DEFLUX SYSTEM-
  • the Deflux system of KAKEN TECH surely clean flux residue that hinders high speed and stable data...
  • KAKEN TECH CO., LTD.
  • INTERNEPCON JAPAN
  • PRECISION MACHINING / CNC LATHE & MACHINING CENTER / OTHERS
  • With 250 machine tools and 90 years of experience, we can meet various needs for automotive, tele...
  • KAWASHIMA MANUFACTURING CO., LTD.
  • FINE PROCESS TECHNOLOGY EXPO
  • OPTICAL FIBER ASSY AND OTHERS
  • - Feedthrough fiber array cords for various modules for digital coherent (compatible with glass s...
  • KAWASHIMA MANUFACTURING CO., LTD.
  • FINE PROCESS TECHNOLOGY EXPO
  • HIGH FREQUENCY TRANSMISSION PARTS
  • - Various wire and wireless RF coaxial connectors (DC to 145 GHz) and various cable assemblies -...
  • KAWASHIMA MANUFACTURING CO., LTD.
  • FINE PROCESS TECHNOLOGY EXPO
  • PCB CUTTING BY UV LASER LPKF MICROLINE 2000 SERIES
  • The LPKF MicroLine 2000 systems can process even highly complicated tasks with printed circuit bo...
  • LPKF LASER & ELECTRONICS K.K.
  • INTERNEPCON JAPAN
  • NEXT-GENERATION REWORK STATION MS9000SE PC
  • As for the next-generation rework station MS9000SE for multi user, Extensions after the device in...
  • MEISHO CO., LTD.
  • INTERNEPCON JAPAN
  • RE-BALLING & PRINTING TOOL REBCOM RBC-1
  • It is some important things"Printing"and"Re-balling"for rework. At present,we are suffering from...
  • MEISHO CO., LTD.
  • INTERNEPCON JAPAN
  • LABOJET
  • MICROJET CORP.
  • IC & SENSOR PACKAGING TECHNOLOGY EXPO
  • AEROSOL JET
  • MICROJET CORP.
  • IC & SENSOR PACKAGING TECHNOLOGY EXPO
  • NANOPRINTER
  • MICROJET CORP.
  • IC & SENSOR PACKAGING TECHNOLOGY EXPO
  • GHZ BAND VIBRATION OBSERVATION SYSTEM
  • GHz Band Vibration Observation System is an unique observation product for surface vibration. The...
  • NEOARK CORPORATION
  • FINE PROCESS TECHNOLOGY EXPO
  • [COMING SOON] PL201D
  • New Laser decapsulation system
  • NIPPON SCIENTIFIC CO., LTD.
  • IC & SENSOR PACKAGING TECHNOLOGY EXPO
  • ATMOSPHERIC PLASMA NEEDLE DECAPSULATION SYSTEM: MP101
  • Atmospheric plasma needle decapsulation system adopted the plasma needle method developed by Plas...
  • NIPPON SCIENTIFIC CO., LTD.
  • IC & SENSOR PACKAGING TECHNOLOGY EXPO
  • LASER IC OPENER: PL201
  • NSC IC Opener PL201 is equipped with fiber laser, so it has achieved a lower cost and longer life...
  • NIPPON SCIENTIFIC CO., LTD.
  • IC & SENSOR PACKAGING TECHNOLOGY EXPO
  • HIGH POWER CO2 LASER PROCESSING UNIT [TLSU-SERIES] (NEW PRODUCT)
  • Main applications: Laser slitter, laser stripping of copper wire coating, fiber sheet cutting, no...
  • TAKEI ELECTRIC INDUSTRIES CO., LTD.
  • INTERNEPCON JAPAN
  • LASER CUTTING SYSTEM FOR OPTICAL FILM [TLSM-301]
  • Industry's fastest and high-definition CO2 laser processing equipment
  • TAKEI ELECTRIC INDUSTRIES CO., LTD.
  • INTERNEPCON JAPAN
  • TGV
  • TGV metallization pattern technology (Feature) -Miniaturization of device, Multi-layer implemen...
  • TECNISCO LTD.
  • IC & SENSOR PACKAGING TECHNOLOGY EXPO
  • ULTRA P(MEMS HANDLER)
  • The ULTRA P is high performance production handler that provides thermal conditioning, full 6 DOF...
  • TESEC CO.
  • IC & SENSOR PACKAGING TECHNOLOGY EXPO
  • 4605-HTR (DIE SORTER)
  • 4605-HTR is a Tesec's latest High Speed MAP Sorter which picks up devices from wafer ring and sor...
  • TESEC CO.
  • IC & SENSOR PACKAGING TECHNOLOGY EXPO
  • 431-TT (DISCRETE DEVICE TEST SYSTEM)
  • The Model 431-TT is Tesec's newest DC Parametric Test System which employs an Open Architecture w...
  • TESEC CO.
  • IC & SENSOR PACKAGING TECHNOLOGY EXPO
  • THINNING IS A METAL POWER INDUCTOR OF THE FEATURE.IT HAS THE ABUNDANT LINE-UPS OF THE HEIGHT.
  • MCP Series Large current, low DC-resistance and high efficiency by magnetic metal powder. Low...
  • TOKYO COIL ENGINEERING CO., LTD.
  • ELECTRONIC COMPONENTS & MATERIALS EXPO
  • LOW LEAKAGE FLUX TO THE OUTSIDE BY COMPLETE CLOSED MAGNETIC CIRCUIT STRUCTURE OF POWER INDUCTOR. IT'S APPROPRIATE TO IMPROVEMENT OF EMI.
  • SHP Series Low leakage flux to the outside by complete closed magnetic circuit structure. Cor...
  • TOKYO COIL ENGINEERING CO., LTD.
  • ELECTRONIC COMPONENTS & MATERIALS EXPO
  • PRECISION CUTTING OF CERAMIC PARTS
  • We handle dicing and slicing technology for hard and brittle ceramics, from thin to thick, from p...
  • TOKYO DENSHI KOGYO CO., LTD.
  • FINE PROCESS TECHNOLOGY EXPO
  • PRECISION CUTTING OF GLASS PARTS
  • We handle dicing and slicing technology for hard and brittle glass, from thin to thick, from prot...
  • TOKYO DENSHI KOGYO CO., LTD.
  • FINE PROCESS TECHNOLOGY EXPO
  • PARTS FEEDER
  • Vibration-free parts feeder
  • TORAY PRECISION CO., LTD.
  • INTERNEPCON JAPAN
  • ULTRA-PRECISION FINE PROCESSING
  • - Nozzle (Dispenser, Inkjet nozzle) - Apertuer - Closed impeller(Metal 3D Printing) - Fine Mo...
  • TORAY PRECISION CO., LTD.
  • INTERNEPCON JAPAN
  • METAL 3D PRINTING CONTRACT MANUFACTURING SERVICE
  • Metal 3D Printing + Finising processing
  • TORAY PRECISION CO., LTD.
  • INTERNEPCON JAPAN
  • POWER FUSE
  • AMC Series Features Low I2T value Fact-acting, high breaking capacity Voltage rating up to 80...
  • CONQUER ELECTRONIC CO., LTD.
  • ELECTRONIC COMPONENTS & MATERIALS EXPO
  • SURFACE MOUNT FUSE -SMD
  • SEH/SEF/SET Series Features Suitable for use in both AC and DC circuits Includes both fast-act...
  • CONQUER ELECTRONIC CO., LTD.
  • ELECTRONIC COMPONENTS & MATERIALS EXPO
  • AXIAL LEAD AND CARTRIDGE FUSE
  • AXT/AXT-A Series Features Various current/voltage ratings, breaking capacities, I2t values, tim...
  • CONQUER ELECTRONIC CO., LTD.
  • ELECTRONIC COMPONENTS & MATERIALS EXPO
  • PLATING PRODUCT SAMPLE
  • You can actually see!
  • EPTEC CORP.
  • FINE PROCESS TECHNOLOGY EXPO
  • FERRIETE BEADS/ INDUCTORS
  • A professional manufacturer of SMD multilayer Inductor/chip beads from Taiwan
  • MAX ECHO CORP.
  • ELECTRONIC COMPONENTS & MATERIALS EXPO
  • SUPER THICK INSULATION WIRE
  • Wide diameter range:0.028mm~0.40mm,This is a wire that enamelled with super thick insulation.the ...
  • SUNTEK WIRE(TAISHAN) CO., LTD.
  • ELECTRONIC COMPONENTS & MATERIALS EXPO
  • FIW
  • Fully insulated zero-defect enamelled rouand copper wire is the wire with high thermal class,Zero...
  • SUNTEK WIRE(TAISHAN) CO., LTD.
  • ELECTRONIC COMPONENTS & MATERIALS EXPO
  • ULTRA FINE RECTANGULAR WIRE
  • Applications:Consumer Electronics, Auto Electronics, Communications Electronics. End user: APPLE,...
  • SUNTEK WIRE(TAISHAN) CO., LTD.
  • ELECTRONIC COMPONENTS & MATERIALS EXPO
  • SOLVENT-SOLUBLE LOW DK/DF POLYIMIDE RESIN VARNISH [PIAD]
  • Thermoplastic solvent-soluble polyimides, Low Dk/Df, High heat resistance, High adhesivity, Good ...
  • ARAKAWA CHEMICAL INDUSTRIES LTD.
  • ELECTRONIC COMPONENTS & MATERIALS EXPO
  • SPHEROLYTE UF3
  • Electrolytic copper plating process that makes copper pillars with ultra-high speed and low stres...
  • ATOTECH JAPAN K.K.
  • IC & SENSOR PACKAGING TECHNOLOGY EXPO
  • LOW DIELECTRIC TYPE PI RESIN
  • Low Dk and low Df
  • CHIN YEE CHEMICAL INDUSTRIES CO., LTD.
  • PRINTED WIRING BOARDS EXPO
  • ROLL TO ROLL TYPE HIGH-PRECISION AUTOMATIC APPLICATION DEVICE RX SERIES
  • Equipped with AI function Continuous application by belt conveyance.
  • CREATIVE COATINGS CO., LTD.
  • ELECTRONIC COMPONENTS & MATERIALS EXPO
  • FLEX RIGID BOARD
  • Implementation of space saving, downsizing, thinning, and heat radiation
  • DAISHO DENSHI CO., LTD.
  • PRINTED WIRING BOARDS EXPO
  • ADAS (ADVANCED DRIVER ASSISTANCE SYSTEM) BOARD
  • Introduces printed circuit boards that can be used in various sensing systems such as millimeter ...
  • DAISHO DENSHI CO., LTD.
  • PRINTED WIRING BOARDS EXPO
  • FE-880
  • 1. Suppression pit formation (pitting corrosion) during etching 2. Significant reduction of unde...
  • JCU CORP.
  • IC & SENSOR PACKAGING TECHNOLOGY EXPO
  • CU-BRITE TF6
  • 1. Better pattern surface uniformity than conventional baths 2. Excellent BVH/TH filling perform...
  • JCU CORP.
  • IC & SENSOR PACKAGING TECHNOLOGY EXPO
  • HIGH FREQUENCY
  • high frequency
  • K2 CO., LTD.
  • ELECTRONIC COMPONENTS & MATERIALS EXPO
  • DRY FILM RESIST STRIPPER CLEANTHROUGH "A" SERIES
  • From ultra-fine patterns to safe & green chemistry, Kao offers various types of dry film resist s...
  • KAO CORP.
  • ELECTRONIC COMPONENTS & MATERIALS EXPO
  • CLEANTHROUGH 618
  • 618 is optimized to have high flux cleaning performance, while maintaining material compatibilit...
  • KAO CORP.
  • ELECTRONIC COMPONENTS & MATERIALS EXPO
  • ENHANCEMENT OF ADHESION
  • It produces unique copper surface topography with less etching amount, which can minimize reducat...
  • MEC COMPANY LTD.
  • IC & SENSOR PACKAGING TECHNOLOGY EXPO
  • SELECTIVE ETCHING AGENT
  • MEC have chemicals that can protect and remove various metals. Please contact us for more inform...
  • MEC COMPANY LTD.
  • IC & SENSOR PACKAGING TECHNOLOGY EXPO
  • MODIFIED SEMI ADDITIVE PROCESS AGENT
  • We handle various chemicals used in the M-SAP process.
    Please contact us for more information.
  • MEC COMPANY LTD.
  • IC & SENSOR PACKAGING TECHNOLOGY EXPO
  • HIGH HEAT RESISTANCE, LOW DIELECTRIC, MALEIMIDE RESIN
  • Maleimide resin with excellent heat resistance and dielectric properties and solvent solubility
  • NIPPON KAYAKU CO., LTD.
  • ELECTRONIC COMPONENTS & MATERIALS EXPO
  • LOW CTE FLUORO-CARBON RESIN SUBSTRATE FOR MULTI-LAYERED BOARD
  • The low CTE Fluoro-carbon resin substrate under development has suppressed CTE in the thickness d...
  • NIPPON PILLAR PACKING CO., LTD.
  • ELECTRONIC COMPONENTS & MATERIALS EXPO
  • CHROMATIC SENSOR
  • Precitec products deliver inline and offline measurements with the highest precision and ultra-fa...
  • PRECITEC JAPAN LTD.
  • INTERNEPCON JAPAN
  • HIGH FREQUENCY LAMINATES
  • Low DK and Low loss, various PTFE and thermoset type materials.
  • ROGERS JAPAN INC.
  • PRINTED WIRING BOARDS EXPO
  • PHP-900 SERIES
  • permanent hole plugging ink
  • SAN-EI KAGAKU CO., LTD.
  • PRINTED WIRING BOARDS EXPO
  • THE WORLD'S SMALLEST SOLDER PASTE JET DISPENSER
  • Achieves jet dispensing of 150micron or less.



  • SHINWA CO., LTD.
  • INTERNEPCON JAPAN
  • 5G PWB
  • PWB use for 5G site
  • SIHUI FUJI ELECTRONICS TECHNOLOGY CO., LTD.
  • INTERNEPCON JAPAN
  • HIGH HARDNESS, STRONG ADHESION, HEAT-RESISTANT THERMAL DISSIPATION COATINGS
  • SQ153 transparent, emissivity 0.90, Hv240, high adhesion, wear resistance, heat resistance 873K, ...
  • S-TECHC & BRIGHT LION
  • PRINTED WIRING BOARDS EXPO
  • CHARACTERIZATION OF 5G RELATED MATERIALS
  • Physical property evaluation and impurity analysis of 5G related materials are possible.
  • SUMIKA CHEMICAL ANALYSIS SERVICE, LTD.
  • ELECTROTEST JAPAN
  • EVALUATION OF ADHESION MECHANISM OF DISSIMILAR MATERIALS
  • Bond strength test and chemical structure analysis of adhesives are possible.
  • SUMIKA CHEMICAL ANALYSIS SERVICE, LTD.
  • ELECTROTEST JAPAN
  • OPTICAL FIBER DIRECT-COUPLED TERAHERTZ WAVE GENERATION MODULE
  • Using organic nonlinear optical crystal with high figure of merit Easy-to-use with optical fiber...
  • TECNISCO LTD.
  • IC & SENSOR PACKAGING TECHNOLOGY EXPO
  • TMMR/TMMF SERIES
  • TMMR Series is photoresist for MEMS application. This ultra thick film material offering covers a...
  • TOKYO OHKA KOGYO CO., LTD.
  • IC & SENSOR PACKAGING TECHNOLOGY EXPO
  • TSS TSC SERIES
  • EMI Shieding film and conductive film for FPC
  • TOYOCHEM CO., LTD.
  • PRINTED WIRING BOARDS EXPO
  • LOW DK/DF ADHESIVE SHEET
  • Low DK/Df adhesive sheet has exellent heat-resistance.
  • TOYOCHEM CO., LTD.
  • PRINTED WIRING BOARDS EXPO
  • MULTILAYER PCBS
  • We can handle from double side to 18 layers PCBs. We are a specialized manufacturer of 5G commun...
  • WUZHU TECHNOLOGY (HONG KONG) LIMITED
  • PRINTED WIRING BOARDS EXPO
  • FLEXIBLE BOARD AND RIGID FLEXIBLE BOARD
  • We can handle from single layer to 6 layers flexible board and the rigid flexible board (Max: 12L...
  • WUZHU TECHNOLOGY (HONG KONG) LIMITED
  • PRINTED WIRING BOARDS EXPO
  • HDI (HIGH DENSITY INTERCONNECT PCBS)
  • We can handle from 1+N+1, i+N+i (i>2), Anylayer HDI. We are a specialized manufacturer of mobile...
  • WUZHU TECHNOLOGY (HONG KONG) LIMITED
  • PRINTED WIRING BOARDS EXPO
  • TRANSMISSION CHARACTERISTIC MEASURING DEVICE
  • for measuring transmission characteristic of Panel PCB in high speed & accuracy.
  • YAMAHA FINE TECHNOLOGIES CO., LTD.
  • INTERNEPCON JAPAN
  • POWER DEVICE - MOSFET, TRANSISTOR, DIODE
  • MOSFET - LV MOSFET / MV MOSFET / HV MOSFET / High speed MOSFET Transistor - Bipolar Transistor /...
  • CYSTECH ELECTRONICS CORP.
  • ELECTRONIC COMPONENTS & MATERIALS EXPO
  • GRAPHENE CARBON FIBER INTERFACE MATERIAL
  • High performance thermal conductive interface pad, offers outstanding thermal conductive at 25W/m*K
  • SHENZHEN HANHUA THERMAL MANAGEMENT TECHNOLOGY CO., LTD.
  • ELECTRONIC COMPONENTS & MATERIALS EXPO
  • 5G TV ANTENNA
  • multilayer ultra thin, immersion tin,immersion silver
  • WUPING FEITIAN ELECTRONICS TECH. CO., LTD.
  • ELECTRONIC COMPONENTS & MATERIALS EXPO
See Many Other Exhibitors & Exhibits!
●Technologies for MaaS
●AI (Artificial Intelligence)
●Autonomous Driving & ADAS
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